Product teams creating custom electronics
Move from modules and development boards to an integrated board designed around the product's requirements and form factor.
Electronic architecture, schematic, layout, prototyping, testing, BOM, and manufacturing preparation
Rokad supports PCB development from electronic requirements and architecture through schematic, layout coordination, prototyping, testing, sourcing, and manufacturing preparation.
Designed for / 01
PCB development connects product requirements, components, power, signal integrity, interfaces, mechanics, firmware, testing, availability, and manufacturing. Rokad can lead the electronic design or coordinate specialist design and fabrication partners under an integrated product-development process.
Move from modules and development boards to an integrated board designed around the product's requirements and form factor.
Address component availability, cost, performance, reliability, testability, certification, or manufacturing constraints.
Align electronics, firmware, enclosure, connectors, power, sourcing, testing, and production readiness.
Challenges / 02
Board outline, connectors, height, thermal, antennas, mounting, enclosure, and assembly constraints are not coordinated early.
Test points, programming, diagnostics, fixtures, calibration, current measurement, and production checks are missing.
Components are unavailable, unauthorised, obsolete, single-sourced, over-specified, or difficult to substitute.
Capabilities / 03
Electronic requirements, block diagrams, interfaces, power, and component architecture
Schematic capture, component selection, design review, and library coordination
PCB stack-up, placement, routing, power, signal, RF, thermal, and mechanical coordination
BOM, alternatives, lifecycle, cost, sourcing, and supply-risk assessment
Fabrication, assembly, stencil, panel, programming, and vendor coordination
Bring-up, test points, fixtures, diagnostics, validation, revision, and failure analysis
Firmware, enclosure, certification preparation, documentation, and production handoff
Solution components / 04
Functions, processors, power, interfaces, sensors, memory, protection, communication, clocks, and component choices.
Schematic, libraries, stack-up, placement, routing, signal, power, thermal, mechanical, antenna, and DFM constraints.
Fabrication, assembly, bring-up, programming, measurements, fixtures, tests, failures, fixes, and revisions.
Gerbers, drill, drawings, pick-and-place, BOM, assembly, programming, test, revision, and supplier documentation.
Use cases / 05
Integrate processor, power, sensors, controls, communications, memory, connectors, and test access into a product board.
Develop low-power sensing, wireless, antenna, charging, provisioning, enclosure, and manufacturing foundations.
Connect compute modules, peripherals, power, industrial interfaces, expansion, protection, and mechanical constraints.
Improve availability, cost, testability, assembly, reliability, thermal, signal, certification, and supplier readiness.
Architecture and integration / 06
Validate power budgets, rails, sequencing, protection, levels, connectors, buses, bandwidth, timing, and environmental constraints early.
Provide programming, measurement, isolation, calibration, fixtures, diagnostics, and production checks before layout is frozen.
Track lifecycle, lead time, authorised sources, alternates, footprints, firmware impact, and qualification requirements.
Quality and control / 07
Fit, function, load, environment, power, interfaces, tolerance, material, production, and service constraints guide design decisions.
High-risk assumptions are tested with measurable prototypes, inspection, iteration, and documented findings before scale.
Component availability, manufacturing method, assembly, testing, certification, repair, and lifecycle are considered early.
Delivery / 08
Clarify the objective, users, systems, constraints, dependencies, risks, and measurable acceptance criteria.
Define the target design, interfaces, controls, migration or delivery sequence, and operating model.
Implement in controlled increments with testing, review, documentation, observability, and stakeholder validation.
Establish ownership, service controls, measurement, support, and a prioritised improvement backlog.
Typical deliverables
Engagement models / 09
A bounded evidence review, target direction, prioritised risks, and executable next-stage plan.
A defined implementation, migration, prototype, procurement, or transformation outcome with acceptance criteria.
Specialists working alongside internal product, engineering, data, operations, security, or procurement teams.
Ongoing ownership, maintenance, monitoring, supplier coordination, reliability, security, and improvement.
Related capabilities / 10
Develop firmware, drivers, diagnostics, and board-level behaviour.
Coordinate board outline, connectors, mounting, thermal, and enclosure constraints.
Validate electronic architecture before production-board investment.
Cloud, software, hardware, electronics, vendors, sourcing, and lifecycle management.
Cloud architecture, platforms, CI/CD, Kubernetes, security, reliability, and migration.
Application, cloud, security, reliability, maintenance, and continuous engineering operations.
FAQ
Scope, ownership, assumptions, delivery, security, and long-term operation are clarified before work begins.
Rokad can coordinate fabrication, assembly, component sourcing, stencil, panelisation, programming, testing, logistics, and supplier communication through suitable partners.
Yes. We assess functional, electrical, footprint, firmware, certification, thermal, supply, and lifecycle implications before selecting and validating alternatives.
Yes. Embedded firmware, board bring-up, drivers, diagnostics, test firmware, communication, update, and product integration can be included.
Depending on scope: source design files, schematics, Gerbers, drill, fabrication drawings, pick-and-place, BOM, assembly notes, programming, test, and revision records.
Product engineering and prototyping
Rokad can define the board, coordinate the design, build prototypes, validate behaviour, and prepare the manufacturing package.
Contact / 05
Tell us what you need to build, improve, procure, deploy, or operate. We will respond with a practical next step.